Tageos expands microwave-compatible RFID portfolio for food packaging

Tageos has introduced two new microwave-compatible RAIN RFID inlays designed for food retail and quick-service restaurant applications.

The new EOS-450 MW M830 and EOS-450 MW UX are designed to provide item-level identification and inventory visibility while addressing the handling requirements of packaged foods. Their antenna designs are engineered to resist arcing and sparking under defined microwave conditions, allowing RFID labels to remain on suitable food packaging when products are defrosted or heated in a microwave.

The two versions use different RAIN RFID IC platforms. The Impinj M830-based EOS-450 MW provides 128-bit EPC memory, extended read range, AutoTune performance, improved backscatter efficiency and Gen2X enhancements. The NXP UCODE X-based version provides configurable EPC memory from 96-208 bits, up to 32 bits of user memory, Gen2v2 compliance, rapid encoding and memory safeguards with auto-repair.

By enabling RFID labels to remain with appropriate food packaging throughout its lifecycle, the inlays can support applications including inventory and expiration-date management, track and trace, loss prevention and self-checkout.

“The market for RAIN RFID-based food tagging is growing rapidly, and customers are increasingly demanding inlays that are specifically tailored to the practical requirements of modern food packaging and handling,” says Jeremy Wade, vice president of sales Americas, Advanced Business, at Tageos.

According to Wade, combining microwave compatibility with RAIN RFID performance is becoming increasingly important as retailers and QSRs expand item-level RFID deployments.

The EOS-450 MW products are available in dry, wet clear, paper-face and plastic-face formats, providing multiple integration options for label converters and service bureaus.

Tageos says the two inlays represent the first products in a broader portfolio of microwave-compatible RAIN RFID products planned for food packaging applications.